Ceramic substrate cutting, drilling, and cutting, suitable for various oxide ceramics, diluted ceramics, including alumina, aluminum nitride, zirconia, glass oxide, silicon nitride, silicon carbide, aluminum nitride, piezoelectric ceramic sheets (Pb3O4, ZrO2, TiO2), sodium chloride ceramics (soft ceramics), magnesium chloride ceramics, boron oxide, boron nitride, and other ceramic materials. It can also be used for cutting and slicing various types of silicon wafers.
QCW fiber laser processing equipment is a fine micro processing system that uses continuous or modulated fiber lasers to process products through optical shaping and focusing. It has the characteristics of good cutting effect, high accuracy, fast speed, stable performance, low cutting cost, and maintenance free. It is suitable for laser cutting, slicing, or drilling of high hardness brittle materials such as ceramics, sapphires, or metal materials.
Equipment features
1. Integrated structure, pollution-free, compact and small in size, good beam quality, stable output power, long service life, capable of flexible processing, with high flexibility and low energy consumption.
2.Adopting high-quality collimated cutting heads, with excellent cutting effects, equipped with coaxial blowing system and dust extraction system.
3High precision motion system, equipped with a linear motor motion platform and a high-precision marble base to ensure the precision and stability of equipment operation.
4Easy to operate, able to meet the needs of automated production
5Specialized laser cutting software andCCDThe automatic positioning system easily meets the needs of large-scale production and high-precision machining. The system software has powerful functions and is compatibleCORELDRAW、AUTOCADVarious drawing software can be used to edit and move any cutting shape within a plane.
Applications
Mainly used for cutting, drilling, and marking various ceramics, sapphires, and metals. It has a wide range of applications in industries such as aerospace, electronic materials, instrumentation, and electromechanical products.
TECHNICAL INDEX
Laser medium |
optical fiber |
wavelength |
1064 nm |
Maximum laser output power |
150W/300W |
Maximum peak power |
1500W/3000W |
repetitive frequency |
1~1000HzContinuing Adjust |
Minimum focused spot diameter |
30um |
Maximum cutting thickness |
2mm(Ceramic substrate) |
Minimum drilling aperture |
0.3mm(Under the condition of ensuring roundness) |
Linear motor worktable stroke |
300mm×300mm |
ZAxis electric focusing stroke |
ZAxial travel50mm;ZAxis focusing resolution1um |
Positioning accuracy and repeatability accuracy |
X Yaxle The positioning accuracy is ±5um |
X YMaximum idle travel speed of the axis |
1000mm/s |
Continuous working hours |
approve24Working continuously for hours |
power supply |
exchange220V,50Hz,2000VA |
Weight |
1800Kg |